- All sections
- C - Chemistry; metallurgy
- C23C - Coating metallic material; coating material with metallic material; surface treatment of metallic material by diffusion into the surface, by chemical conversion or substitution; coating by vacuum evaporation, by sputtering, by ion implantation or by chemical vapour deposition, in general
- C23C 18/38 - Coating with copper
Patent holdings for IPC class C23C 18/38
Total number of patents in this class: 309
10-year publication summary
45
|
38
|
43
|
45
|
39
|
35
|
23
|
25
|
11
|
3
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Tokyo Electron Limited | 11599 |
14 |
Rohm and Haas Electronic Materials LLC | 637 |
13 |
Eastman Kodak Company | 3444 |
11 |
Mitsubishi Engineering-Plastics Corporation | 311 |
7 |
Atotech Deutschland GmbH | 586 |
6 |
C. Uyemura & Co., Ltd. | 156 |
6 |
Catlam LLC | 27 |
6 |
FUJIFILM Corporation | 27102 |
5 |
TDK Corporation | 6306 |
5 |
Lam Research Corporation | 4775 |
5 |
Honeywell International Inc. | 13799 |
4 |
Texas Instruments Incorporated | 19376 |
4 |
Industrial Technology Research Institute | 4898 |
4 |
Hamilton Sundstrand Corporation | 4525 |
4 |
BYD Company Limited | 3700 |
4 |
Gerhardi Kunststofftechnik GmbH | 26 |
4 |
Mitsubishi Gas Chemical Company, Inc. | 3188 |
4 |
Okuno Chemical Industries Co., Ltd. | 95 |
4 |
Ymt Co., Ltd. | 30 |
4 |
BASF SE | 19740 |
3 |
Other owners | 192 |